First to release HKMG products in foundry

32nm Process Technology as the First HKMG in Foundry Industry

Samsung Foundry has qualified 32nm Low Power, High-K Metal Gate in Jun, 2010 which was the first HKMG product in foundry industry.
Combining HK/MG with Gate first technology realized both extreme high performances and high area efficiency even without drastic
changes in Poly-Si based conventional design methodology. 32nm HKMG process boasts up 30% higher speed, 30% less power,
30% scaling with twice of SRAM density over 45nm technology, making it ideal for high performance mobile applications.
32nm process is developed with abundant design ecosystem suitable for high performance mobile applications.

28nm Process Technology Meeting the Needs of Low-Power, High-Performance SoC Designs
Samsung's 28nm Low-Power High-K Metal Gate Process is built on two years of development and successful high-volume production of the 32nm LP HKMG process technology for a remarkably simple migration path.

Due to the complexity of multi-patterning and the introduction of FinFET transistors at 14nm, 28nm low-power High-K Metal Gate (HKMG) is expected to be a long-lived node with multiple product generations developed on this process. To address the growing need for different variations of the process, Samsung Foundry has broadened its portfolio to include the following offerings.
Device offerings
28nm RF Process Technology

Samsung foundry offers chip designers the ability to integrate advanced RF functionality into their designs for connectivity applications,
which is 28RF process technology. Through the collaboration with EDA partners, 28RF process design kit (PDK) and verification method
has been released to several customers, which has been proven by simulation and silicon results in real design.

28nm eNVM Process Technology

Samsung foundry has been developing competitive and differentiating eNVM technology with innovative special memory, such as eMRAM,
which is cost effective enough to replace conventional eFlash technology with better power/performance. MCU application including
automotive and IoT will be the major target application.

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