July 26, 2001 in Social Responsibility News

Develops the World's Most Advanced Package for LCD Driver ICs

SEOUL, Korea # July 26, 2001 #Samsung Electronics has developed a new package technology that greatly reduces the size of LCD Driver ICs, a main component found in liquid crystal displays. Market demands for smaller, multifunctional mobile handsets are driving the trend of next generation technology. And ever smaller and compact devices are introduced to meet the challenge. As a core component in today’s electronic devices, semiconductors compete in a new field “Chip on Film (COF)” package technology.

Samsung Electronics has been working to constantly make its semiconductors smaller and lighter. Now, the company has completed development of a new technology that can be applied to the fabrication of integrated circuits used in liquid crystal displays. With this technology, narrow pitch packaging for chip on film (COF) devices, which are thinner than other ICs, has broken the 40-micron barrier for the first time. This reduces the conventional chip size down 12%.

The technology will make the chips smaller and provide them with more channels from the current 500 to 700 or more. Therefore reducing the number of components required.
Samsung expects the compact package technology to rise as a main package for mobile products.

In accordance with the new package design, Samsung has developed circuits to accommodate the special properties resulting from decreased chip size. Thereby, providing full technical assistance in the utilization of the new package technology.

For mass production the same fabrication facilities can be used and no additional costs will be incurred. The chip surface area will be smaller, helping to lower production cost and enhance price competitiveness.

Recently, chip package technology represents 10-15% of the chip price. The smaller the chip, the greater the added value, so competition over this technology has intensified in the industry.

Samsung Electronics plans to begin full-scale production of the 40-micron COF devices in the first half of 2002. Armed with the new technology, Samsung aims to capture 26% of the market for value-added driver ICs used in TFT-LCDs and color STN LCDs, Samsung predicts the world LDI(LCD Driver IC) market to exceed 5.0billionUS$ by 2005.

About Samsung Electronics

Samsung Electronics Co. Ltd. is a global leader in semiconductors, the consumer electronics industry, and digital convergence technology. With year 2000 sales of US $27 billion, Samsung employs approximately 66,000 people in 46 countries. The company is the world’s largest producer of memory chips, TFT-LCDs, CDMA mobile phones and monitors and the sixth-largest manufacturer of mobile phones. Samsung Electronics consists of four main business units: Digital Media, Semiconductor, Information & Communications, and Home Appliance Businesses. For more information, please visit http://samsungelectronics.com.

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