June 25, 2003 in Social Responsibility News

SAMSUNG's Application Processors Power HP’s Newest iPAQ PDAs

Seoul, Korea, June 23, 2003-Samsung Electronics Co., Ltd., a leader in semiconductor technology, today announced that its ARM9™-based S3C2410 application processor solution has been designed into two of Hewlett Packard’s newest iPAQ hand-held devices. The S3C2410 has been selected for its ability to lower power consumption and deliver optimum performance in the newly announced h1930 and h1940 iPAQ models.

The h1930 model features the 203MHz version of the S3C2410, allowing HP to offer a value-driven PDA with a great balance of performance and power consumption in a form factor that easily fits into a pocket. For the h1940, the 266 MHz version of the S3C2410 supports premium performance through increased processor speed and a faster 133 MHz memory bus. The S3C2410 also enables very appealing end-user features on these iPAQs such as color LCD display support, SD/MMC/SDIO, USB host and device, and touch screen interface.

“The Samsung S3C2410 product line provides a great combination of performance and power consumption,” said Cindy Box, the director of marketing at HP handhelds. “We are extremely pleased to offer the performance characteristics of Samsung’s processors in the sleek 1900 series HP iPAQ Pocket PCs.”

“The S3C2410 allows seamless interoperability between Microsoft Windows Mobile software and the applications developed for the operating system,” said Dr. Yun Tae Lee, vice president of SOC R&D Center at Samsung Electronics, “We look forward to continuing work with leading OEM companies like Hewlett Packard to help bring next generation, feature-rich mobile computing solutions to the consumer and enterprise markets.”

Developed around an ARM920T CPU core, Advanced Micro-controller Bus Architecture (AMBA), compiled memory and Harvard cache architecture with separate 16KB instruction and 16KB data caches, the Samsung S3C2410 presents an efficient, fully static design solution that is suitable for low-power applications such as PDAs and smart phones. The S3C2410 also interfaces to high density NAND flash memory and includes a host of peripherals in a small 14x14 mm package that is only 1.16mm in height. The fully featured S3C2410 delivers optimized CPU performance while saving design space and eliminating the need to configure additional components.


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