March 08, 2004 in Social Responsibility News

Technology Partnership with IBM

□ Details
- The partnership aims to enhance the competitiveness of Samsung Electronics' SoC business.
- Partnership agreement
ㆍLicensor : IBM and two other companies
ㆍTechnology subject to the agreement : Next generation logic processing technology (90 nm ~ 45 nm)
※300mm wafer 90 nm logic processing technology and 300mm wafer 65/45 nm logic processing technology
ㆍSamsung Electronics will license the 90 nm logic processing technology from IBM and co-develop the 65/45 nm logic processing technology.

□ Purpose
- The partnership will facilitate SEC to enhance competitiveness of its SoC business by shortening the technology development window and cutting its costs.


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