Exynos 5 Dual

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General Description

An application processor, or SoC (System on a Chip), is a microprocessor with a specialized architecture for deployment in embedded systems, such as digital still/video cameras, digital/smart TVs and set-top boxes, and automotive systems, among others. An SoC operates at frequencies from several hundred MHz to a few GHz, and is architected to deliver significant computing performances at low power consumption levels in limited board spaces. High-end SoCs often contain multiple cores, enabling them to deliver exceptional performances in applications such as digital imaging and multimedia devices.

Current-generation SoCs are capable of running full-fledged versions of modern operating systems, providing the user a rich, interactive interface on devices such as smartphones and tablet computers. Almost all the latest SoCs have the ability to decode a majority of multimedia codecs, and contain hardware engines to deliver enhanced multimedia experiences to the user. They also contain dedicated MMUs (memory management units) to manage the memory for applications being run on the device. Recent SoCs also have a multitude of peripheral connectivity solutions on the chip, offering the designer extensive control in providing connectivity options on the device. SoCs are application specific, and contain features targeted towards the intended deployment segment. Thus, an SoC designed for a mobile handset would include front-end GSM RF functionalities on-chip, which would be absent in an SoC designed for deployment in a digital still camera. An increasing number of SoCs, however, are now offering a wide range of features, making the processor suitable for deployment on any application. Samsung is a worldwide leader in providing the most advanced, efficient, and customizable SoC solutions for deployment on a wide range of platforms, such as digital imaging, multimedia, and mobile communication and computing. Samsung’s line of SoCs offers the highest performance, thermal stability, reliability, and I/O density in the smallest form factors at the lowest power consumption levels. Worldwide, Samsung is the preferred provider for SoC solutions for a majority of developers and OEMs for deployment on the broadest computing and communication devices and platforms.

Specifications

Detail Features
  • CortexA15 dual core subsystem with 64-/128-bit SIMD NEON
  • 32KB (Instruction)/32KB (Data) L1 Cache and 1MB L2 Cache
  • 128-bit Multi-layered bus architecture
  • Internal ROM and RAM for secure booting, security, and general purposes
  • Memory Subsystem
  • - 2-ports 32-bit 800MHz LPDDR3/DDR3 Interfaces
    - 2-ports 32-bit 533MHz LPDDR2 Interfaces
  • 8-bit ITU 601 Camera Interface
  • Multi-format Video Hardware Codec: 1080p 60fps (capable of decoding and encoding MPEG-4/H.263/H.264 and decoding only MPEG-2/VC1/VP8)
  • 3D and 2D graphics hardware, supporting OpenGL ES 1.1/2.0/Halti, OpenVG 1.1 and OpenCL 1.1 full profile
  • Image Signal Processor : supporting BayerRGB up to 14bit input with 14.6MP 15fps, 8MP 30fps through MIPI CSI2 & YUV 8bit interfaces and special functionalities such as 3-dimensional noise reduction (3DNR), video digital image stabilization (VDIS) and optical distortion compensation (ODC)
  • JPEG Hardware Codec
  • LCD single display, supporting max WQXGA, 24bpp RGB, YUV formats through MIPI DSI or eDP
  • Simultaneously display of WQXGA single LCD display and 1080p HDMI
  • HDMI 1.4 interfaces with on-chip PHY
  • 2-ports (4-lanes) MIPI CSI2 interfaces
  • 1-port (4-lanes) eDisplayPort (eDP)
  • 1-channel USB 3.0 Device or Host, supporting SS (5Gbps) with on-chip PHY
  • 1-channel USB 2.0 Host or Device, supporting LS/FS/HS (1.5Mbps/12Mbps/480Mbps) with on-chip PHY
  • 2-channel USB HSIC, supporting 480Mbps with on-chip PHY
  • 1-channel HS-MMC 4.5
  • 1-channel SDIO 3.0
  • 2-channel SD 2.0 or HS-MMC4.41
  • 4-channel high-speed UART (up to 3Mbps data rate for Bluetooth 2.1 EDR and IrDA 1.0 SIR)
  • 3-channel SPI
  • 1-channel AC-97, 2-channel PCM, and 3-channel 24-bit I2S audio interface, supporting 5.1 channel audio
  • 1-channel S/PDIF interface support for digital audio
  • 4-channel I2C interface support (up to 400kbps) for PMIC, HDMI, and general-purpose multi-master
  • 4-channel HS-I2C (up to 3.1 Mbps)
  • Samsung Reconfiguration Processor supports low power audio play
  • MIPI-HSI v1.1, supporting 200Mbps full-duplex
  • C2C, supporting through path between DRAM and MODEM
  • Security subsystem supporting hardware crypto accelerators, ARM TrustZone and TZASC
  • 32-channel DMA Controller
  • Configurable GPIOs
  • Real time clock, PLLs, timer with PWM, multi-core timer, and watchdog timer

Block Diagram

Samsung Semiconductor Block Diagram

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However, subsequent product improvements may render some details inaccurate.

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Product information is accurate at the time of publication. However, subsequent product improvements may render some details inaccurate.

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Product information is accurate at the time of publication.
However, subsequent product improvements may render some details inaccurate.