MCP Package Info.
Package Technology
Package Technology Roadmap
- Smaller, thinner, better performance
- Packaging technologies can overcome the limitations of Fab
- Disruptive packaging technologies enable those!
Application
- Cellular phone
- DSC/DVC
- Mobile Game Machine
- MP3, PDA
- Any Mobile Applications
Key Technology
- Chip Stack
- Double & Long Wire Bonding
- Thin wafer back grinding
- Overhang
- Optimal bonding pad arrangement (order & location)
New Technology Introduction (TSV General)
Standard Package
JEDEC Standard Package
| PKG | PKG Option | Ball Pitch | Coverage | Status |
|---|---|---|---|---|
| MCP |
10.5x13, 137ball 8x13, 188ball 11.5x13, 202ball |
0.8p 0.65p |
NAND+ M-DRAM NOR+NAND or NOR + M-DRAM or NAND + M-DRAM |
JEDEC Passed Mar.05 JEDEC Passed Dec.05 |
| POP |
10x10, 104ball 12x12, 128ball 13x13,136ball 14x14, 152ball |
0.65p 0.65p |
M-DRAM (SDR/DDR) NOR+NAND or NOR + M-DRAM or NAND + M-DRAM |
JEDEC Passed Mar.07 JEDEC Passed Dec.05 |
| moviMCP | 12x16, 199ball 12x18, 199ball |
0.65p | eMMC+NAND+M-DRAM or eMMC+NOR+M-DRAM or eMMC+NOR+NAND+M-DRAM |
JEDEC Passed Mar.08 |
Mobile Application Trend
