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MCP Package Info.

Package Technology

Package Technology Roadmap

  • Smaller, thinner, better performance
  • Packaging technologies can overcome the limitations of Fab
  • Disruptive packaging technologies enable those!

Samsung Semiconductor MCP package info.

Application

  • Cellular phone
  • DSC/DVC
  • Mobile Game Machine
  • MP3, PDA
  • Any Mobile Applications

Key Technology

  • Chip Stack
  • Double & Long Wire Bonding
  • Thin wafer back grinding
  • Overhang
  • Optimal bonding pad arrangement (order & location)

New Technology Introduction (TSV General)

Samsung Semiconductor New Technology Introduction (TSV General)

Standard Package

JEDEC Standard Package

PKG, PKG option, ball pitch, coverage, status
PKG PKG Option Ball Pitch Coverage Status
MCP 10.5x13, 137ball
8x13, 188ball
11.5x13, 202ball
0.8p
0.65p
NAND+ M-DRAM
NOR+NAND or
NOR + M-DRAM or
NAND + M-DRAM
JEDEC Passed Mar.05
JEDEC Passed Dec.05
POP 10x10, 104ball
12x12, 128ball
13x13,136ball
14x14, 152ball
0.65p

0.65p
M-DRAM (SDR/DDR)

NOR+NAND or
NOR + M-DRAM or
NAND + M-DRAM
JEDEC Passed Mar.07

JEDEC Passed Dec.05
moviMCP 12x16, 199ball
12x18, 199ball
0.65p eMMC+NAND+M-DRAM or
eMMC+NOR+M-DRAM or
eMMC+NOR+NAND+M-DRAM
JEDEC Passed Mar.08

Mobile Application Trend

Samsung Semiconductor Mobile Application Trend

News

See all

Samsung Develops Industry's First 8Gb LPDDR4 Mobile DRAM Read more

(Dec. 30. 2013)

Events

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IDF (Intel Developer’s Forum) - Event Image

IDF (Intel Developer’s Forum) Read more

Sep. 9. 2014 ~ Sep. 11. 2014

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