Selecting a suitable package for deploying a particular semiconductor application requires the careful consideration of several physical and electrical factors. This document describes the sequence of steps that is involved in this process, and provides insight into each phase of the process.

Steps in Selecting a Package for an Application

Selecting and finalizing a particular package for a semiconductor application involves multiple stages, each of which is targeted towards meeting a specific goal, such as reliable operation over the intended temperature range, or successful radiation of generated heat under standard operating conditions. The ultimate goal of this process is to create a package that results in a highly-reliable, error-free device, under the working environment that the device is designed to be deployed in.

Sequence of steps involved in selecting a design for a semiconductor package

The following subsections list and describe the steps illustrated above.

Phase 1: Feasibility Study

The very first phase in the package selection process is the feasibility study phase. This phase consists of the following steps:

Once the design passes the feasibility study phase, it proceeds to the next phase, wherein the first draft of the details for the package is created.

Phase 2: Initial Package Design

The following steps are carried out during the initial package design phase:

The design, after passing all the steps in the initial design phase, proceeds to the production facilities. Together with the production processes, the final phase of the package design is carried out, as described next.

Phase 3: Final Package Design

The final package design phase takes place in parallel with the production of the design samples. The following steps are carried out during the final package design phase:

At the end of this phase, the specifications for the design are finalized for production.

Phase 4: Quality Improvement using DFSS

Using business process management methodologies defined in DFSS (Design for Six Sigma), areas that can be improved for the packaging and production processes are identified. This is usually accomplished via meetings and discussions between senior technical and managerial staff.

Phase 5: Finalizing the Manufacturing Specifications

This is the last phase of the package design process, performed using an automated tool. In this phase, specifications for the package, such as its height, dimensions, pin/ball widths, and gap between pins/balls are specified in the production tool. Based on the selected fabrication technique, the tool then generates output data for the design to be supplied to the production fabs.