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      • STACK CELL ABOVE CELLS,

        V-NAND TechnologySTACK CELL ABOVE CELLS,
        BUILD TECHNOLOGY ABOVE TECHNOLOGIES

      Shedding light on a whole new standard of capacity and performance.

      Samsung V-NAND technology overcomes the capacity limitations of traditional 2D NAND technology with its revolutionary vertical design.
      V-NAND also applies innovative Charge Trap Flash (CTF) technology which prevents data corruption caused by cell-to-cell interference.
      The synergy of both structural and material innovations leads to improved speed, power efficiency, and endurance.
      Vertical expansion breaks through horizontal limits.
      Vertical expansion breaks through horizontal limit.
      Samsung revolutionized the storage industry by shifting the planar NAND to a vertical structure. Samsung V-NAND technology features a unique design that stacks 48 layers on top of one another instead of trying to decrease the cells’ pitch size. Samsung used Channel Hole Technology (CHT) to enable cells to connect vertically with one another through a cylindrical channel that runs through stacked cells.
      Material innovation that no one can match.
      Material innovation that no one can match.
      Samsung has shifted the paradigm of material used for NAND. Samsung applies the innovative CTF technology which uses a non-conductive layer of Silicon Nitride (SiN), temporarily trapping electrical charges to maintain cell integrity.

      This non-conductive layer wraps around the control gate of the cell, acting as an insulator that holds charges to prevent data corruption caused by cell-to-cell interference.

      Vertical architecture paves the way for amplified capacity.
      Vertical architecture paves the way for amplified capacity.
      Layering cells vertically in three-dimensional stacks provides much greater cell density. Samsung V-NAND technology lets heavy-workload users and data centers store and handle more data with greatly improved capacity.

      Samsung V-NAND enables up to 100 layers of cells to be stacked with the potential to scale the density up to 1 Terabit. The 2D planar NAND density ceiling can only reach the minimum density of V-NAND.
      Innovative algorithms equal faster performance
      Innovative algorithms equal faster performance
      Traditional planar NAND memory requires the creation of sets of complex program algorithms to prevent data corruption caused by cell-to-cell interference. However, Samsung V-NAND is virtually immune to cell-to-cell interference.

      V-NAND does not need to go through a complex program algorithm to write data, and this enables the memory to write data up to two times faster than traditional 2D planar NAND flash memory.
      Unprecedented power efficiency
      Unprecedented power efficiency
      Since V-NAND technology has eliminated the issue of cell-to-cell interference, its programming steps are greatly reduced. As a result, power consumption is substantially lowered by up to 45 percent compared to planar NAND memory.
      Embedded high endurance to store your valuable data
      Embedded high endurance to store your valuable data
      Samsung V-NAND provides up to twice the endurance of planar NAND. V-NAND decreases its electric field because its cells are slightly larger, and employs CTF-based insulators eliminating the risk of cell-to-cell interference, resulting in superior retention performance.

      In comparison between 3-bit and 2-bit, Samsung 3-bit V-NAND shows endurance similar to that of 2-bit planar NAND, and even better performance in heavy workloads. V-NAND also shows a sustained P/E cycle for longer periods of time.

      Related Resources

      • White Paper (3)
        • Samsung 2bit V-NAND Technology
          Gain more capacity, speed, endurance and power efficiency
          08 Aug, 2015
        • Samsung V-NAND SSD PM863 White Paper
          Optimized solid-state drives ideal for data center environments.
          04 Aug, 2015
        • Samsung 3bit V-NAND Technology
          Yield more capacity, performance and power efficiency
          18 Aug, 2015

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